creat by art - glass passivated chip junction - ideal for automated placement - low forward voltage drop - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test s1d s1g s1j s1k s1m v rrm 200 400 600 800 1000 v v rms 140 280 420 560 700 v v dc 200 400 600 800 1000 v i f(av) a t rr s c j pf t j c t stg c version: b1603 case: do-214ac (sma) maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter polarity: indicated by cathode band s1g -k a maximum rms voltage weight: 0.06 g (approximately) maximum average forward rectified current 1 s1d-k - S1M-K 1a, 200v - 1000v surface mount rectifiers features moisture sensitivity level: level 1, per j-std-020 s1 k -k - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data s1m -k unit do-214ac (sma) taiwan semiconductor 1.1 1 symbol s1d -k maximum instantaneous forward voltage (note 1) @ 1 a v f t j =25c s1j -k peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm c/w v i r a maximum reverse current @ rated v r 12 30 t j =125c maximum repetitive peak reverse voltage note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. note 1: pulse test with pw=300 s, 1% duty cycle storage temperature range - 55 to +175 marking code - 55 to +175 50 maximum dc blocking voltage typical reverse recovery time (note 2) operating junction temperature range note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a typical thermal resistance r jl r ja typical junction capacitance (note 3) 1.5 30 85
part no. note 2: whole series with green compound version: b1603 ratings and characteristics curves (t a =25c unless otherwise noted) s1d-k - S1M-K taiwan semiconductor ordering information packing code suffix package preferred part no. packing code suffix r3 packing g sma 1,800 / 7" plastic reel S1M-K r3g g sma 7,500 / 13" paper reel green compound packing code r2 r3 part no. S1M-K note 1: "x" defines voltage from 200v (s1d-k) to 1000v (S1M-K) example description packing code s1x-k (note 1, 2) 0 0.2 0.4 0.6 0.8 1 1.2 0 255075100125150175 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve resistive or inductive load 1 10 100 1 10 100 peak forward surge urrent (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics t j =125 c t j =75 c t j =25 c 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristics pulse width=300 s 1% duty cycle
min max min max a 1.27 1.58 0.050 0.062 b 4.06 4.60 0.160 0.181 c 2.29 2.83 0.090 0.111 d 1.99 2.50 0.078 0.098 e 0.90 1.41 0.035 0.056 f 4.95 5.33 0.195 0.210 g 0.05 0.20 0.002 0.008 h 0.15 0.31 0.006 0.012 p/n = marking code g = green compound yw = date code f = factory code version: b1603 s1d-k - S1M-K taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) do-214ac (sma) suggested pad layout symbol unit (mm) unit (inch) a 1.68 0.066 b 1.52 0.060 c 3.93 0.155 marking diagram d 2.41 0.095 e 5.45 0.215 1 10 100 0.01 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. version: b1603 s1d-k - S1M-K taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
|
